Seminar Schedule 2008-2009
Package, Engineering, Design, and Testing (3 day) PED 310 Cost $1450
San Jose
June 10 through 12, 2008
Who Should Attend
Eliminate package redesign and meet your Launch
date!
This course is for professionals involved with packaging materials
sourcing, package testing, or package design. You need this course
if you have recently been charged with making sure your product can
make it through the distribution leg of the Supply Chain. This course
is designed for professionals in all industries to better understand
packaging dynamics.
At the end of this three-day hands-on course you will understand the
importance of product testing and how to use that information. You
will understand the relationship between your product, the package,
and the distribution environment. You will understand what information
your package designer needs to design a proper package… the first
time and eliminate the trial and error method of package design.
Instructor:
Mark Escobedo, WESTPAK, Inc.
Areas Covered:
Day 1
Review Of Terminology
Dynamics Overview
Distribution Environment Quantification
Typical Test Specifications (ASTM D4169 and ISTA 2A)
Effects of Altitude
Temperature & Humidity Levels
Day 2
Determination of Product Sensitivity to Vibration
and Shock
Cushion Material Testing (Where does the data come from?)
Package Design for Vibration and shock
Package Testing for Vibration and Impacts
Day 3
Conduct the package test
Did your package pass the test?
Package System Optimization,
Performance Tests vs. Engineering Design Verification Tests
Test Documentation
Overview:
This seminar is an advanced seminar which will
focus primarily on the development of a test sequence, product fragility
analysis, and cushion design. Vibration and drop testing concepts
will also be reviewed. Substantial time will be allotted for lab exercises
including running actual tests on the lab equipment, designing &
testing packages, explaining the results to other groups, and Q&A.
Networking with other professionals is an important part of any conference
and is encouraged at WESTPAK seminars.
Shock Response Spectrum Analysis
San Jose
July 23, 2008
Who should attend?
Product Engineers, Reliability Engineers, Project
Mangers, and Quality Managers
This is an advanced course covering the product response to shock
input. The spring/mass model will be used throughout the discussion
to relate product response product characteristics.
Instructors:
Herb Schueneman and Mark Escobedo, WESTPAK, Inc.
Areas Covered:
Introduction & history
Time or frequency domain
The SDOF model
SRS usage & applications
Types of SDOF response
Initial & residual responses
Maximax response plot
Damping and its effects
SRS of classical pulses
SRS & Damage Boundary
SRS for package drop tests
Mil Std applications
SRS model requirements
Replicating field shocks w/SRS
Overview:
These and other areas are presented with a focus on applications without
unneeded equations in a manner that increases comprehension and reduces
confusion. The seminar includes time for lab demonstrations of the
covered tests and Q&A. Networking with other professionals is
an important part of any conference and is encouraged at WESTPAK gatherings.
Medical Package Testing & Validation (One Day) MPT 165 Cost $495
San Diego
August 20, 2008
Who should attend?
QA Managers, Project Mangers and Assembly Technicians.
This course will focus on the development of a successful package
testing protocol based on the requirements for package testing outlined
in ANSI/AAMI/ISO 11607 with focus on Part 2 of this document. This
course is for professionals in established companies as well as start-ups.
The course will focus primarily on Protocol Development and laboratory
time will be dedicated to Sterile Integrity testing. At the completion
of this course you will have a better understanding of the packaging
requirements for sterile devices.
Instructor:
Mark Escobedo, Westpak, Inc.
Areas Covered:
Review of terminology
Dynamics overview
Distribution environment quantification
Temperature & humidity levels
Performance Tests ASTM D 4169, ISTA tests
Effect of Altitude
ANSI/AAMI/ISO 11607 Parts 1 and 2
TIR 22 Guidance Document
Determination of product vibration and shock sensitivity
Shock and Vibration
Heat-seal validation
Sterile Barrier Testing (Bubble ASTM F2096, Peel ASTM F88, Burst test
ASTM F1140)
Shelf-life Study (Real-time and Accelerated aging ASTM F1980)
Internal Company Protocol Development
Define parameters
Test documentation
Overview:
This seminar will focus on the development and execution of a test
validation plan. The seminar includes time for lab demonstrations
of the covered tests and Q&A. Networking with other professionals
is an important part of any conference and is encouraged at WESTPAK
gatherings.
Package Drop Testing
October 8, 2008
Who should attend?
Package Designers, Distributors, Project Managers,
Product Developers
This course is designed for those who possess a basic or introductory
knowledge in the area of drop testing and want to increase their understanding
of drop testing.
Instructor:
Mark Escobedo, WESTPAK, Inc.
Areas Covered:
Review of cushion dynamic testing
Specifications and procedures
Proper instrumentation
Drop height determination
Number and orientation of impacts
Use of the data collected
Waveform analysis
Drop test setup
Temperature & humidity effects
Overview:
Considerable time will be devoted to actually running the test procedures,
collecting data, and analyzing the results. This is a "hands-on"
seminar to help each attendee master the techniques of collecting
and analyzing drop test data. Networking with other professionals
is an important part of any conference and is encouraged at WESTPAK
seminars.
Package Vibration Testing (One Day) VPT 120 Cost $495
San Jose
Date: November 19, 2008
Who should attend?
Package Designers, Distributors, Project Managers,
Product Developers
This course is designed for those who possess a basic or introductory
knowledge in the area of vibration testing and want to increase their
understanding of vibration testing.
Instructor:
Mark Escobedo, WESTPAK, Inc.
Areas Covered:
Terminology Overview
SDOF Spring/Mass Modeling
The Concept of Resonance
Fatigue or Dwell Tests
Damping
Measuring the Distribution Environment
Vibration Sensitivity Using Sine
Vibration Sensitivity Using Random
Measuring Cushion Vibration Performance
Common Materials for Vibration Package Design
Package Testing and Design Modification Mechanical "Bounce"
Test
Specifications
Case Histories
Overview:
This seminar is a basic seminar covering the concepts of vibration
testing in detail. The seminar will focus on applications in a manner
that increases comprehension and reduces confusion. Lab demonstrations
and reference materials are included. Networking with other professionals
is an important part of any conference and is encouraged at WESTPAK
seminars
ISTA vs ASTM
Pitfalls and procedures
Overview :
This seminar will cover myths and mysteries of the ISTA 2 series, 3 series, and ASTM D4169 test protocols. This seminar is for people who are familiar with testing or are required to understand the package testing protocol. The seminar will cover similarities and differences between the two protocols and how to use them