WESTPAK is pleased to announce its sponsorship of the ISTA TransPack & TempPack Forum. The event will occur in Houston, Texas, from May 1st to 3rd, 2023.
We are also very proud that WESTPAK’s Lab Manager, Edmund Tang, and Test Engineer II, Eric Cardiel, have been chosen to present to attendees on May 2nd.
Their presentation, “Performance of Thermal Shipping Systems Following Distribution,” focuses on a recent study evaluating the thermal performance degradation of a shipping system immediately following exposure to ISTA test inputs.
The Forum is ISTA’s signature event where the packaging community comes together to tackle today’s challenges, explore industry best practices, discover the latest trends, and shape the future of transport packaging.
Please join us to learn and network with global packaging industry experts! Use code WESTPAK2023 for $125 off your 2023 ISTA Forum registration.