Westpak, Inc. continued our strong relationship with Cal Poly San Luis Obispo’s Industrial Technology & Packaging program this spring by sponsoring the annual Poly Pack Symposium once again. The daylong event gathers packaging professionals from around the nation to discuss new topics, learn new techniques, and network.
As an event sponsor Westpak, Inc. sent Andrew Bevil, Test Engineer III, to present on this year’s “Innovations in Packaging” theme. Andrew’s presentation outlined the need to remember the fundamental purpose of a package, and the need to test the package system as well as the product when being innovative.
A total of eight companies presented with topics including “Packaging Value Growth Through Conversion,” “Designing for the Consumer Experience,” “Innovation: Delivering the Experience of Joy.” The full list can be found on the event’s webpage.
Along with the presentations given by industry professionals, guests were treated to a tour of the incredible Industrial Technology and Packaging facilities. Placed just outside of the packaging lab is a structure created primarily of corrugated fiberboard. It was designed and fabricated by students for entry into an Architecture engineering competition. The structure won a People’s Choice award and is quite impressive.
The day was capped off with a banquet and silent auction at a local restaurant. As always, the event was well planned and provided an opportunity for students to interact with industry professionals throughout the day. Westpak looks forward to our continued relationship with Cal Poly and specifically the Industrial Technology and Packaging program.